Ltcc Ceramic Package

They offer excellent resistance to the shock of drop testing and are well suited as module substrate materials in mobile communication devices.

Ltcc ceramic package. A low cost multilayer low temperature co fired ceramic ltcc package based on a mass production design rule for an mmic up to w band has been developed. Hermetic multilayer ceramic packages and substrates are ideal for more complex packaging solutions such as micro electronic mechanical systems mems and high frequency applications because such packages are hermetic and. Our custom made ceramic leadless chip carriers are suited for applications that warrant a surface mounted low profile package having low inductance. Htcc components generally consist of multilayers of alumina or zirconia with platinum tungsten and molymanganese metalization.

Ltcc also features the ability to embed passive elements such as resistors capacitors and inductors into the ceramic package minimising the size of the completed module. High lead count packages. Ceramic packages for mems sensors. Agcu eutectic or low temperature soldering e g.

Kyocera s ltcc hard materials have a high flexural strength 400mpa that is equivalent to alumina ceramics. The multilayer ceramic is co fired at high temperatures to form a solid and hermetic ceramic. Schott is also able to supply low temperature cofired ceramic ltcc housings through its partnership with via electronic. Ltcc low temperature co fire ceramics is a multi layer glass ceramic substrate which is co fired with low resistance metal conductors at low firing temperature less than 1000.

Neo tech has emerged as north america s leading manufacturer of quality low temperature co fired ceramic ltcc and high temperature co fired htcc substrates and packages. A plated ni or ni au coating on the accessible metal structures offers the possibility for high temperature brazing using e g. For htcc a final metal coating e g. Components for fiber optic connectors.

High strength materials ltcc hard. Ltcc substrate with embedded passive components. It is sometimes referred to as glass ceramics because its composition consists of glass and aluminum. Ceramic packages for power electronics.

Package types multilayer technology provides 3 dimensional design flexibility for high performance requirements ceramic to metal htcc technology provides design freedom for ceramic feedthroughs in metal housings circular and rectangular the limitless design configurations provide the highest density hermetic packaging solutions available. These fabrication technologies provide unique solutions for high interconnect density compact networks and high. Ceramic packages for light emitting diodes leds ltcc packages for rf modules. Surface mount ceramic packages for electronic devices.

2 3 low cost multilayer ceramic package for flip chip mmic up to w band. Ceramic packages for automotive electronics. High reliability ceramic substrates ltcc htcc. Ausn eutectic process steps.